Beijing, China

Hongda Chen

This inventor holds 1 USPTO granted patent. Top assignee: Chinese Academy of Sciences. Active years: 2022.


% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2022

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1 patent (USPTO):Explore Patents

Title: Innovations of Hongda Chen in GaN-based VCSEL Technology

Introduction

Hongda Chen is a prominent inventor based in Beijing, China. He has made significant contributions to the field of semiconductor technology, particularly in the development of GaN-based vertical-cavity surface-emitting laser (VCSEL) chips. His innovative work has the potential to advance various applications in optoelectronics.

Latest Patents

Hongda Chen holds a patent for a "GaN-based VCSEL chip based on porous DBR and manufacturing method of the same." This invention includes a substrate, a buffer layer, a bottom porous DBR layer, and several other components that enhance the performance of the VCSEL chip. The design features an n-type doped GaN layer, an active layer, and a current limiting layer, among others. This innovative structure aims to improve the efficiency and functionality of GaN-based laser technology.

Career Highlights

Hongda Chen is affiliated with the Chinese Academy of Sciences, where he conducts research and development in semiconductor technologies. His work has garnered attention for its potential applications in various fields, including telecommunications and data transmission.

Collaborations

Hongda Chen has collaborated with notable colleagues such as Lixia Zhao and Chao Yang. Their combined expertise contributes to the advancement of research in semiconductor technologies.

Conclusion

Hongda Chen's contributions to GaN-based VCSEL technology exemplify the innovative spirit of modern inventors. His patent reflects a significant advancement in the field, showcasing the potential for future developments in optoelectronics.

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