This inventor holds 1 USPTO granted patent and 3 published patent applications. Top assignee: Chinese Academy of Sciences. Active years: 2021.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2021
Title: Innovations of Hongchun Wu in 3D Printing Technology
Introduction
Hongchun Wu is a notable inventor based in Fuzhou, China. He has made significant contributions to the field of 3D printing technology. His innovative approach has led to the development of a unique apparatus that enhances the efficiency and effectiveness of 3D printing processes.
Latest Patents
Hongchun Wu holds a patent for a "3D printing apparatus and method." This apparatus features a radiation source, a workbench, and a liquid tank. The workbench supports the three-dimensional object being constructed, while the liquid tank contains a polymerizable liquid essential for the construction process. Additionally, the apparatus includes a cover plate that is either located in the liquid tank or positioned on top of it. The radiation source irradiates from above the cover plate, which is transparent to the radiation. The lower surface of the cover plate remains in contact with the polymerizable liquid throughout the printing process. This innovative design allows for more precise and efficient 3D printing.
Career Highlights
Hongchun Wu is affiliated with the Chinese Academy of Sciences, where he continues to advance research in 3D printing technologies. His work has garnered attention for its potential applications in various industries, including manufacturing and healthcare.
Collaborations
He collaborates with esteemed colleagues such as Zixiong Lin and Huagang Liu. Their combined expertise contributes to the ongoing development of innovative solutions in the field of 3D printing.
Conclusion
Hongchun Wu's contributions to 3D printing technology exemplify the impact of innovative thinking in modern engineering. His patented apparatus represents a significant advancement in the field, showcasing the potential for future developments in 3D printing applications.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
