Hongbo Li

Title: Innovations of Hongbo Li in Thin Film Deposition

Introduction

Hongbo Li is a notable inventor based in Tempe, AZ (US). He has made significant contributions to the field of thin film deposition through his innovative work on Group V and VI transition metal precursors. His research focuses on enhancing the properties of films deposited on various substrate surfaces.

Latest Patents

Hongbo Li holds 1 patent for his invention titled "Group V and VI transition metal precursors for thin film deposition." This patent describes Group V and VI compounds that serve as precursors for depositing films containing these elements. The invention utilizes ligands with alkyl, amide, imide, amidinate groups, and/or cyclopentadienyl (Cp) ligands to form complexes that are effective for deposition. The resulting films exhibit superior properties such as uniformity, continuity, and low resistance.

Career Highlights

Hongbo Li is currently employed at Versum Materials US, LLC, where he continues to advance his research in material science. His work has implications for various applications, particularly in the electronics and semiconductor industries.

Collaborations

Some of his notable coworkers include Guocan Li and Sergei Vladimirovich Ivanov. Their collaborative efforts contribute to the innovative research environment at Versum Materials.

Conclusion

Hongbo Li's contributions to the field of thin film deposition through his patented innovations demonstrate his expertise and commitment to advancing material science. His work continues to influence the development of high-quality films for various applications.