Shanghai, China

Hongbo Geng

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Dell Products Inc.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hongbo Geng. Retrieved from https://idiyas.com/inventor/hongbo-geng

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Hongbo Geng: Inventor of a Fast Method for Creating Multi-Node Clusters

Introduction

Hongbo Geng is an inventor based in Shanghai, China, and is associated with Dell Products Inc. His patent work addresses a faster way to set up multi-node computer clusters.

Latest Patents

Geng is named on 1 patent: “Fast Method for Creating Multi-Node Clusters.” The disclosed method boots a first cluster node from attached storage, such as a USB drive, into a bootstrap operating system. That system starts PXE and file-sharing services, while software bundles for the target operating system are copied to the first node’s persistent storage. Other nodes can then PXE-boot into the bootstrap operating system and receive the software bundles from the first node over a high-speed switch.

Career Highlights

Geng’s listed patent is associated with Dell Products Inc. It describes a cluster-provisioning approach that uses an initial node to distribute operating-system software to additional nodes, potentially streamlining deployment.

Collaborations

The provided information lists Jun Chen and Yun Sun as Geng’s coworkers. No further details about their roles in the patent or their collaborations with Geng were provided.

Conclusion

Hongbo Geng’s patent focuses on accelerating multi-node cluster creation through coordinated booting and software distribution, reflecting his association with technology innovation at Dell Products Inc.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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