Shanghai, China

Hongbo (Daniel) Zhang

USPTO Granted Patents = 4 

Average Co-Inventor Count = 2.3

ph-index = 1


Company Filing History:


Years Active: 2023-2025

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4 patents (USPTO):Explore Patents

Title: Innovations of Hongbo (Daniel) Zhang

Introduction

Hongbo (Daniel) Zhang is a prominent inventor based in Shanghai, China. He has made significant contributions to the field of connector technology, holding a total of 4 patents. His work focuses on enhancing the functionality and reliability of connectors used in various electronic applications.

Latest Patents

Zhang's latest patents include innovative designs that address common challenges in connector systems. One of his patents is for a connector housing that features a body defining an accommodating channel sized to receive a pin terminal. This design includes a blocking structure positioned to prevent a bent portion of a pin terminal from rebounding. Another notable patent is for a conductive terminal designed to be installed in an insulative housing of a connector. This terminal comprises a mating portion for engaging with a terminal of a mating connector and a crimping portion for securing to a wire. A blocking portion of the terminal engages with the insulative housing to constrain the movement of the conductive terminal in both longitudinal and perpendicular directions.

Career Highlights

Zhang is currently employed at Tyco Electronics (Shanghai) Co., Ltd., where he continues to innovate and develop new technologies. His work has been instrumental in advancing connector designs that improve performance and reliability in electronic devices.

Collaborations

Throughout his career, Zhang has collaborated with talented individuals such as Qin (Candy) Xu and Jianding Du. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Hongbo (Daniel) Zhang is a notable inventor whose contributions to connector technology have made a significant impact in the industry. His innovative patents and collaborative efforts continue to drive advancements in electronic connectivity.

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