Shanghai, China

Hongbin Shi

This inventor holds 3 USPTO granted patents and 2 published patent applications. Top assignee: Huawei Technologies Co., Limited. Active years: 2021-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hongbin Shi. Retrieved from https://idiyas.com/inventor/hongbin-shi-to2d0v7t

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 3 

% Patents Active = 100.0

Average Co-Inventor Count = 3.8

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2021-2025

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3 patents (USPTO):Explore Patents

Title: Innovations of Hongbin Shi

Introduction

Hongbin Shi is a notable inventor based in Shanghai, China. He has made significant contributions to the field of electronics, particularly in the development of printed circuit board assemblies and electronic devices. With a total of three patents to his name, his work reflects a commitment to enhancing the functionality and reliability of electronic components.

Latest Patents

Hongbin Shi's latest patents include a printed circuit board assembly and an electronic device. This application provides a printed circuit board assembly that includes a functional network designed to deliver electrical functions. The assembly features a conductive part connected to the printed circuit board, which operates in parallel with the functional network. Additionally, a cover-shaped structure is incorporated to prevent the conductive part from contacting external conductors, thereby reducing impedance and improving current utilization. Another patent focuses on an electronic package, terminal, and method for processing electronic packages. This device comprises a connecting plate and a circuit element, with a solder connection that includes multiple solder balls. An underfill layer is formed to bond the circuit element to the connecting plate, enhancing the overall reliability of the connection.

Career Highlights

Hongbin Shi is currently employed at Huawei Technologies Co., Limited, a leading global provider of information and communications technology (ICT) infrastructure and smart devices. His role at Huawei allows him to leverage his expertise in electronics and contribute to innovative solutions in the tech industry.

Collaborations

Hongbin has collaborated with notable coworkers, including Runqing Ye and Haohui Long. Their teamwork has likely fostered an environment of innovation and creativity, leading to advancements in their respective projects.

Conclusion

Hongbin Shi's contributions to the field of electronics through his patents and work at Huawei Technologies Co., Limited highlight his role as a significant inventor. His innovations continue to impact the industry positively, showcasing the importance of research and development in technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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