Company Filing History:
Years Active: 2023-2025
Title: **Inventor Profile: Hong-Ta Kuo**
Introduction
Hong-Ta Kuo is an innovative inventor located in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology through his patent on methods and systems for improving fusion bonding. His work is highly regarded within the industry, particularly in the context of enhancing the quality of fusion bonds between substrates.
Latest Patents
Hong-Ta Kuo holds one patent titled "Methods and systems for improving fusion bonding." This patent discloses a novel approach where plasma treatment is applied to a substrate before the fusion bonding process. This method leaves residual charge on the substrate that is then dissipated through an electrically conductive silicone cushion on a loading pin. The technique involves measuring the residual voltage on a test silicon wafer to ensure the silicone cushion remains effective throughout its usable lifetime. This innovation significantly improves the quality of fusion bonds in production environments.
Career Highlights
Currently, Hong-Ta Kuo is employed at Taiwan Semiconductor Manufacturing Company Ltd., a leading organization in the semiconductor manufacturing sector. His expertise in fusion bonding processes plays a crucial role in advancing the company's technological capabilities. Kuo’s inventive work has positioned him as a valuable asset in the competitive landscape of semiconductor technology.
Collaborations
Throughout his career, Hong-Ta Kuo has collaborated with his coworker, Yen Hao Huang. Together, they have focused on refining semiconductor processes, contributing to advancements that benefit their organization and the broader semiconductor industry.
Conclusion
In summary, Hong-Ta Kuo's contributions to the field of semiconductor technology through his patent on fusion bonding methods exemplify innovation at its finest. His work not only enhances production quality but also sets a foundation for future advancements in the industry. His collaboration with fellow professionals further showcases the importance of teamwork in driving innovation and technological growth.