Location History:
- Lake Oswego, OR (US) (2005)
- Gresham, OR (US) (2005 - 2008)
- Fremont, CA (US) (2003 - 2010)
Company Filing History:
Years Active: 2003-2010
Title: Innovations of Hong-Qiang Lu in Semiconductor Technology
Introduction
Hong-Qiang Lu is a prominent inventor based in Fremont, CA (US), known for his significant contributions to semiconductor technology. With a total of 10 patents to his name, Lu has developed innovative methods and structures that enhance the performance and reliability of semiconductor devices.
Latest Patents
Among his latest patents, Lu has focused on methods and structures for forming copper barrier layers integral with semiconductor substrate structures. This invention aims to improve dielectric copper barrier layers and related interconnect structures. One notable structure includes a semiconductor substrate with a copper line, where an insulating layer made of silicon or carbon is formed on the underlying copper line. An opening is created in the insulating layer to expose a portion of the copper line. The inner surface of this opening features a dielectric barrier layer to prevent copper diffusion into the insulating layer. A copper plug is then formed to fill the opening, ensuring electrical contact with the underlying copper interconnect structure. Additionally, Lu has developed dielectric barrier films for use as copper barrier layers in semiconductor trench and via structures, further enhancing the reliability of interconnects.
Career Highlights
Lu has had a distinguished career, working with notable companies such as LSI Logic Corporation and LSI Corporation. His work has significantly impacted the semiconductor industry, particularly in the development of advanced interconnect technologies.
Collaborations
Throughout his career, Lu has collaborated with esteemed colleagues, including Wilbur G. Catabay and Wei-Jen Hsia, contributing to various innovative projects in semiconductor technology.
Conclusion
Hong-Qiang Lu's contributions to semiconductor technology through his patents and collaborations have made a lasting impact on the industry. His innovative approaches to copper barrier layers and interconnect structures continue to influence advancements in semiconductor design and manufacturing.