This inventor holds 1 USPTO granted patent and 1 published patent application and 1 EPO patent. Top assignee: Korea Institute of Science and Technology. Active years: 2021.
Company Filing History:
Years Active: 2021
Title: Innovations of Hong Jin Lim in Thermal Conductivity
Introduction
Hong Jin Lim is a notable inventor based in Jeollabuk-do, South Korea. He has made significant contributions to the field of polymer composites, particularly in enhancing thermal conductivity. His work is recognized for its potential applications in various industries, including electronics and materials science.
Latest Patents
Hong Jin Lim holds a patent for "Composites with enhanced thermal conductivity and method preparing the same." This patent describes a high thermal conductive polymer composite that includes a liquid crystalline resin with a mesogen and at least one linear polymerization reactive group. The innovative aspect of this composite lies in its molecular structure, which is aligned in at least one direction, enhancing its thermal conductivity.
Career Highlights
Lim is affiliated with the Korea Institute of Science and Technology, where he conducts research and development in advanced materials. His expertise in polymer science has positioned him as a key figure in the development of new materials with improved properties.
Collaborations
He has collaborated with notable colleagues, including Nam Ho You and Seokhoon Ahn, contributing to various research projects that aim to advance the field of material science.
Conclusion
Hong Jin Lim's innovative work in thermal conductive composites showcases his commitment to advancing material technology. His contributions are paving the way for future developments in the industry.