Hong-Dyi Chang

Title: The Innovations of Hong-Dyi Chang

Introduction

Hong-Dyi Chang, an accomplished inventor based in Hsinchu, Taiwan, has made significant contributions to the field of integrated circuits. With two patents to his name, Chang's work focuses on innovative packaging structures that enhance the performance and efficiency of semiconductor devices.

Latest Patents

Hong-Dyi Chang's latest patents include a novel quad flat no-lead (QFN) package structure and an integrated circuit package and die. The QFN package innovation comprises a lead frame that includes a die pad and a series of contacts surrounding it. This structure ensures that the distance from the semiconductor die to one side of the die pad is shorter than to the opposite side, optimizing the design for improved electronic performance. The encapsulating material used in the package partially exposes the contacts while encapsulating the lead frame and semiconductor die, resulting in an aspect ratio that meets or exceeds a standardized value of 3.

Additionally, the integrated circuit package and die patent introduces a die carrier with a versatile design suitable for QFN or quad flat package (QFP) structures. The die carrier comprises a die pad capable of supporting the die and a set of leads positioned around the pad, featuring a length ratio that enhances functionality.

Career Highlights

Currently, Hong-Dyi Chang is affiliated with Novatek Microelectronics Corp., a prominent player in the semiconductor industry. His role at the company allows him to leverage his innovative ideas into practical applications within the rapidly evolving technology landscape.

Collaborations

Throughout his career, Chang has collaborated with talented individuals such as Jhih-Siou Cheng and Chun-Wei Kang. These partnerships foster a productive environment where creative solutions and developments in semiconductor technology can flourish.

Conclusion

Hong-Dyi Chang's contributions to the field of integrated circuits exemplify the spirit of innovation inherent in the world of technology. His patents address critical needs in electronic packaging, paving the way for advancements in device performance and reliability. Through his work at Novatek Microelectronics Corp. and collaborations with esteemed colleagues, Chang continues to impact the semiconductor industry significantly.