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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11244891 B1

PDFFull Text
Date of Patent:
Feb. 08, 2022

Filed:

Jul. 21, 2020

Integrated circuit package and die

Applicant:

Novatek Microelectronics Corp., Hsinchu, TW;

Inventors:

Jhih-Siou Cheng, New Taipei, TW;

Hong-Dyi Chang, Hsinchu, TW;

Chun-Wei Kang, Hsinchu, TW;

Chun-Fu Lin, Taoyuan, TW;

Ju-Lin Huang, Hsinchu County, TW;

Assignee:

NOVATEK MICROELECTRONICS CORP., Hsinchu, TW;

Attorney:

JCIPRNET

Primary Examiner:

Marc Anthony Armand

Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 25/18 (2006.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 24/06 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 25/167 (2013.01); H01L 25/18 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49171 (2013.01); H01L 2924/10161 (2013.01); H01L 2924/1426 (2013.01);
Abstract

An integrated circuit package, a die carrier, and a die are provided. The die carrier includes at least one die pad and a plurality of leads. The at least one die pad is suitable for carrying the die. The leads surround the at least one die pad. The leads are disposed on four sides of the die carrier. A length of a long side among the four sides is twice or more a length of a short side among the four sides. The die carrier is suitable for a QFN package or a QFP package.

Find Patent Forward Citations

Cheng, Jhih-Siou. (2022). Integrated circuit package and die (U.S. Patent No. 11244891). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11244891

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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