Hong-beom Kim

Title: Hong-beom Kim: Semiconductor Test and Bonding-Pad Innovations

Introduction

Hong-beom Kim is an inventor associated with Suwon, South Korea, and Samsung Electronics Co., Ltd. His patent work addresses integrated-circuit testing and semiconductor-device reliability. The supplied information lists 2 patents.

Latest Patents

- **Integrated circuit apparatus having improved test circuit and method of testing the integrated circuit apparatus.** This invention describes an integrated circuit that checks its own pass-or-fail status. It compares internal DQ data from a core logic circuit with test patterns set through a mode register set (MRS) code or supplied directly from an external source.

- **Bonding pad in semiconductor device.** This invention describes a bonding pad with at least one slit that electrically connects metal wiring to external leads. The slit may be filled with molding compound to buffer stresses from wire bonding, helping reduce stress-induced corrosion and improve pressure-cooker-test reliability.

Career Highlights

Kim’s listed patents focus on practical semiconductor engineering challenges: testing integrated circuits and improving the durability of bonding pads. Both inventions are associated with Samsung Electronics Co., Ltd.

Collaborations

The supplied information names Yoon-gyu Song and Seong-Min Lee as Kim’s coworkers. It does not specify their roles in the listed patents.

Conclusion

Hong-beom Kim’s patent portfolio reflects work on semiconductor testing and reliability, with inventions intended to support effective circuit evaluation and more robust bonding-pad structures.