Shenzhen, China

Honey Hou

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignees: Avary Holding (Shenzhen) Co., Limited., Garuda Technology Co., Ltd., Qing Ding Precision Electronics (Huaian) Co., Ltd. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Honey Hou. Retrieved from https://idiyas.com/inventor/honey-hou

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Honey Hou: Inventor of a Flexible Circuit Board Design.

Introduction

Honey Hou is an inventor based in Shenzhen, China. Her work includes a patented design for a flexible circuit base board and flexible flat cable.

Latest Patents

Hou is associated with 1 patent: “Flexible Circuit Base Board and Flexible Flat Cable.” The invention describes a flexible flat cable built around a base film carrying spaced conductive wires, transmission and collecting signal pads, and a conductive structure. A cover film protects these components, while a transmission element connects electrically to the collecting signal pad. The design provides an integrated structure for transmitting signals through a flexible cable.

Career Highlights

Hou has been associated with Avary Holding (Shenzhen) Co., Limited, and Qing Ding Precision Electronics (Huaian) Co., Ltd. Her patent reflects work in flexible circuit and electronic interconnection technology.

Collaborations

Hou’s listed coworkers include Dong-Mei Liu and Biao Li. Their names are associated with her professional and patent-related network.

Conclusion

Honey Hou’s patent focuses on combining conductive elements, signal pads, and protective layers in a flexible circuit assembly, highlighting her contribution to electronic interconnection technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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