Essen, Germany

Holger Sauerzapf

This inventor holds 4 USPTO granted patents. Top assignee: Multi-Holding Ag. Active years: 2013-2016.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Holger Sauerzapf. Retrieved from https://idiyas.com/inventor/holger-sauerzapf

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 3

Forward Citations = 90(Granted Patents)


Company Filing History:


Years Active: 2013-2016

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4 patents (USPTO):Explore Patents

Title: Holger Sauerzapf: Innovator in Connector Technology

Introduction

Holger Sauerzapf is a notable inventor based in Essen, Germany. He has made significant contributions to the field of connector technology, holding a total of four patents. His work has been instrumental in advancing the efficiency and reliability of electrical connections.

Latest Patents

Among his latest innovations are a junction box and a connector, which showcase his expertise in creating practical solutions for modern electrical systems. These patents reflect his commitment to enhancing the functionality and safety of electrical components.

Career Highlights

Holger currently works at Multi-Holding AG, where he continues to develop innovative technologies. His role at the company allows him to collaborate with other talented professionals in the field, further driving advancements in connector technology.

Collaborations

Some of his notable coworkers include Andreas Torma and Ronald Henrink, who contribute to a dynamic and innovative work environment. Their collective efforts help push the boundaries of what is possible in their industry.

Conclusion

Holger Sauerzapf's contributions to connector technology through his patents and collaborative efforts highlight his importance as an inventor. His work continues to influence the field and pave the way for future innovations.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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