Munich, Germany

Holger S Tews, Heir

This inventor holds 1 USPTO granted patent. Top assignee: Wild Leitz Gmbh. Active years: 1993.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Holger S Tews, Heir. Retrieved from https://idiyas.com/inventor/holger-s-tews-heir

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 11(Granted Patents)


Company Filing History:


Years Active: 1993

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1 patent (USPTO):Explore Patents

Title: Holger S Tews: Innovator in Quick Disconnectable Screw Devices

Introduction

Holger S Tews is a notable inventor based in Munich, Germany. He is recognized for his innovative contributions to the field of mechanical engineering, particularly in the development of quick disconnectable screw devices. With a single patent to his name, Tews has made a significant impact in his area of expertise.

Latest Patents

Holger S Tews holds a patent for a quick disconnectable screw device. This invention showcases his ability to create practical solutions that enhance efficiency and usability in various applications.

Career Highlights

Tews is currently employed at Wild Leitz GmbH, a company known for its precision engineering and innovative products. His work at the company has allowed him to further develop his skills and contribute to advancements in mechanical design.

Collaborations

Throughout his career, Tews has collaborated with notable individuals, including his late coworker Bruno Tews and Klaus-Dieter Grossmann. These collaborations have enriched his professional journey and fostered a creative environment for innovation.

Conclusion

Holger S Tews is a distinguished inventor whose work in quick disconnectable screw devices exemplifies his commitment to innovation. His contributions continue to influence the field of mechanical engineering, and his legacy is marked by his patent and collaborations.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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