Company Filing History:
Years Active: 1998-2008
Title: Holger Hubner: Innovator in Semiconductor Technology
Introduction
Holger Hubner is a prominent inventor based in Baldham, Germany. He has made significant contributions to the field of semiconductor technology, holding a total of 11 patents. His innovative work has paved the way for advancements in chip design and manufacturing processes.
Latest Patents
Among his latest patents is the "Protected Chip Stack," which features a first chip and a second chip stacked on top of each other. This design includes a functional layer in at least one of the chips, with connecting elements that create a mechanical connection between the two chips. Notably, the connecting elements and the functional layer are made from the same material, ensuring a robust integration. Another significant patent is the "Device and Method for Soldering Contacts on Semiconductor Chips." This invention involves a device that holds a chip on a mount and heats it from the opposite side of the wafer, allowing for efficient soldering through isothermal solidification.
Career Highlights
Holger Hubner has worked with leading companies in the semiconductor industry, including Siemens Aktiengesellschaft and Infineon Technologies AG. His experience in these organizations has greatly influenced his innovative approach to technology.
Collaborations
Throughout his career, Hubner has collaborated with notable professionals in the field, including Helmut Klose and Werner Weber. These partnerships have contributed to the development of groundbreaking technologies in semiconductor applications.
Conclusion
Holger Hubner's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence advancements in chip design and manufacturing processes.