Company Filing History:
Years Active: 1997
Title: The Innovations of Hojo Masayasu in Semiconductor Technology
Introduction
Hojo Masayasu, a notable inventor based in Kawasaki, Japan, has made significant contributions to the field of semiconductor technology. With a patent to his name, he has utilized his expertise to innovate in the realm of integrated circuits, showcasing his dedication to advancing technology.
Latest Patents
Masayasu holds a patent for a “Semiconductor integrated circuit having regularly arranged transistor.” This invention presents a semiconductor integrated circuit that features a chip with an element forming surface. The structure includes an output buffer portion and several output transistors with varying emitter areas arranged in a line along a perpendicular direction to enhance performance. The design also incorporates a pad on the chip, effectively forming an output circuit comprising the buffer, transistors, and pad aligned in a streamlined configuration.
Career Highlights
Throughout his career, Hojo Masayasu has been associated with Fujitsu Corporation, a leading technology company renowned for its innovations in information technology and communication. His work at Fujitsu has provided him with a platform to explore and develop his ideas, leading to advancements in semiconductor circuits that benefit the industry.
Collaborations
In his journey as an inventor, Masayasu has collaborated with talented colleagues, including Katsunobu Nomura and Masaya Tamamura. Their combined efforts in research and development contribute to a collaborative approach that fosters innovation and the creation of effective technological solutions.
Conclusion
Hojo Masayasu’s contributions to semiconductor technology encapsulate the essence of innovation within the electronics industry. His patent reflects not only his inventive spirit but also his commitment to enhancing semiconductor performance through strategic design. As technological demands continue to evolve, inventors like Masayasu play a crucial role in shaping the future of integrated circuits.