Ho Sung Kim

Title: Ho Sung Kim - Innovator in Thermoset Technology

Introduction

Ho Sung Kim is a notable inventor based in New South Wales, Australia. He has made significant contributions to the field of thermoset materials, particularly through his innovative patent that enhances the toughness of epoxy resins. His work is crucial for advancing material science and engineering applications.

Latest Patents

Ho Sung Kim holds a patent for a method of toughening thermosets. This method involves adding expandable hollow microspheres to the base thermoset components in the liquid phase. As the temperature increases, these microspheres expand, which is illustrated in the accompanying graph. The heat treatment applied to the mixture causes the microspheres to expand during or after the curing process of the thermoset. This innovative approach results in a toughening mechanism due to compressive residual stress around the microspheres, significantly increasing the specific fracture energy of the epoxy resin. He has 1 patent to his name.

Career Highlights

Ho Sung Kim is associated with The University of Newcastle Research Associates Limited. His work at this institution has allowed him to explore and develop advanced materials that have practical applications in various industries. His research focuses on improving the performance and durability of thermoset materials.

Collaborations

Ho Sung Kim collaborates with Nam Ho Kim, who is also involved in research related to thermoset technologies. Their partnership enhances the research output and innovation in this field.

Conclusion

Ho Sung Kim's contributions to thermoset technology through his innovative patent demonstrate his commitment to advancing material science. His work not only improves the properties of epoxy resins but also paves the way for future innovations in the industry.