The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2009
Filed:
Jun. 27, 2003
Ho Sung Kim, New South Wales, AU;
Nam Ho Kim, New South Wales, AU;
Ho Sung Kim, New South Wales, AU;
Nam Ho Kim, New South Wales, AU;
The University of Newcastle Research Associates Limited, New South Wales, AU;
Abstract
A method of manufacturing thermosets such as epoxy resins includes adding expandable hollow microspheres, which expand with temperature as shown in the accompanying graph, to the base thermoset components in the liquid phase and applying heat treatment to the mixture so formed causing the micropsheres to expand during or after curing of the thermoset. This results in a toughening mechanism caused by compressive residual stress around the microspheres which significantly increases the specific fracture energy of the epoxy resin.