Ho Hyung Ham

Title: Ho Hyung Ham: Innovator in Embedded Substrate Technology

Introduction

Ho Hyung Ham is a prominent inventor based in Suwon-si, South Korea. He has made significant contributions to the field of embedded substrate technology, holding a total of six patents. His work focuses on enhancing the functionality and efficiency of printed circuit boards.

Latest Patents

One of Ho Hyung Ham's latest patents is the "Connection structure embedded substrate and substrate structure including the same." This innovative design features a printed circuit board that comprises multiple first insulating layers and first wiring layers, strategically arranged on or between these insulating layers. The connection structure within the printed circuit board includes several internal insulating layers and internal wiring layers, which are also arranged on or between the internal insulating layers. Notably, one of the internal wiring layers is positioned to contact a first insulating layer, enhancing the overall connectivity and performance of the substrate.

Career Highlights

Ho Hyung Ham is currently employed at Samsung Electro-Mechanics Co., Ltd., where he continues to develop cutting-edge technologies in the electronics sector. His expertise in embedded substrates has positioned him as a key player in advancing the capabilities of electronic devices.

Collaborations

Throughout his career, Ho Hyung Ham has collaborated with notable colleagues, including Jae Sung Sim and Won Seok Lee. These partnerships have fostered innovation and contributed to the successful development of various technologies.

Conclusion

Ho Hyung Ham's contributions to embedded substrate technology exemplify his dedication to innovation in the electronics industry. His patents reflect a commitment to enhancing the performance of printed circuit boards, making a lasting impact on the field.