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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10932368 B1

PDFFull Text
Date of Patent:
Feb. 23, 2021

Filed:

Feb. 26, 2020

Substrate-embedded electronic component

Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Ha Yong Jung, Suwon-si, KR;

Ho Hyung Ham, Suwon-si, KR;

Jae Sung Sim, Suwon-si, KR;

Won Seok Lee, Suwon-si, KR;

Assignee:

SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;

Attorney:

Morgan, Lewis & Bockius LLP

Primary Examiner:

Sherman Ng

Int. Cl.
CPC ...
H01L 23/538 (2006.01); H05K 1/18 (2006.01); H05K 3/46 (2006.01); H01L 21/48 (2006.01); H01L 21/683 (2006.01); H05K 1/11 (2006.01); H05K 1/02 (2006.01); H01L 23/367 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/187 (2013.01); H01L 21/486 (2013.01); H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/6835 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H05K 1/115 (2013.01); H05K 3/4682 (2013.01); H05K 3/4697 (2013.01); H01L 23/367 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68359 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H05K 1/0206 (2013.01);
Abstract

A substrate-embedded electronic component includes a first core layer, a first through-portion penetrating the first core layer, a first electronic component disposed in the first through-portion, an encapsulant disposed in at least a portion of the first through-portion, and covering at least a portion of the first electronic component, a second core layer disposed on the encapsulant, and a first through-via penetrating the second core layer, wherein the first through-via is connected to the first electronic component.

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Jung, Ha. (2021). Substrate-embedded electronic component (U.S. Patent No. 10932368). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10932368

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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