Company Filing History:
Years Active: 2008
Title: Ho Cheol Jang: Innovator in Surface Acoustic Wave Technology
Introduction
Ho Cheol Jang is a prominent inventor based in Seoul, South Korea. He has made significant contributions to the field of surface acoustic wave (SAW) devices, holding a total of 3 patents. His innovative work focuses on enhancing the efficiency and reliability of electronic packaging technologies.
Latest Patents
One of his latest patents is for a surface acoustic wave (SAW) device package and method for packaging a SAW device. This invention provides a surface-excited device that features a small footprint, low cost, and a streamlined manufacturing process. The design includes a substrate with a SAW active area that is interconnected to external circuits and mechanically mounted using a series of metal pillars and an outer metal sealing wall. This sealing wall not only protects the device from environmental contamination but also minimizes interference. Additionally, it incorporates gaps to alleviate stress caused by thermal expansion differences, which can be filled with a flexible sealant.
Another notable patent is for an image sensor package and its manufacturing method. This invention involves creating a sealing portion between an image sensor die and a glass substrate, ensuring complete isolation of the sensing portion from external environments. Electrically conductive bumps are strategically placed outside the sealing area to connect the image sensor die to the glass substrate. The design allows for the image sensor die to be sealed with a cap while maintaining its connection to the substrate.
Career Highlights
Ho Cheol Jang is currently employed at Amkor Technology, Inc., a leading provider of semiconductor packaging and test services. His work at Amkor has positioned him as a key player in advancing packaging technologies for electronic devices.
Collaborations
Throughout his career, Ho Cheol Jang has collaborated with notable colleagues, including Jong Sik Paek and Seong Min Seo. These partnerships have contributed to the development of innovative solutions in the field of electronic packaging.
Conclusion
Ho Cheol Jang's contributions to the field of surface acoustic wave technology and image sensor packaging demonstrate his commitment to innovation. His patents reflect a deep understanding of the challenges in electronic device manufacturing and a dedication to providing effective solutions.