Hitoshi Takii

Title: Hitoshi Takii: Innovator in Conductive Paste Technology

Introduction

Hitoshi Takii is a prominent inventor based in Osaka, Japan. He has made significant contributions to the field of conductive paste technology, holding a total of 3 patents. His work focuses on enhancing the reliability and performance of multilayer printed wiring boards.

Latest Patents

Takii's latest patents include innovative developments in conductive paste and multilayer printed wiring boards. One of his notable inventions is a conductive paste that comprises flake conductive fillers with a 99% cumulative particle size of 25 µm or less, combined with a binder resin. This conductive paste is designed to fuse with copper foil circuits during connection, ensuring high electrical conductivity and excellent fill ratio in via holes. Another patent details a method for manufacturing multilayer printed wiring boards using a conductive paste that maintains connection resistance even under high temperature and humidity conditions. This paste contains conductive particles and a resin mixture, with specific proportions of epoxy resin and conductive particles to optimize performance.

Career Highlights

Throughout his career, Hitoshi Takii has worked with notable companies such as Sumitomo Electric Industries, Limited and Sumitomo Rubber Industries Limited. His experience in these organizations has allowed him to develop and refine his innovative technologies in conductive materials.

Collaborations

Takii has collaborated with esteemed colleagues, including Yoshio Oka and Noriki Hayashi. Their combined expertise has contributed to advancements in the field of conductive paste and multilayer printed wiring boards.

Conclusion

Hitoshi Takii's contributions to conductive paste technology have significantly impacted the reliability and efficiency of electronic components. His innovative patents and collaborations highlight his role as a key figure in this specialized field.