Sumitomo Electric Industries, Limited

Sumitomo Rubber Industries Limited

Hitoshi Takii

Yoshio Oka

Noriki Hayashi

Toshiaki Sakaki

Tetsuo Mizoguchi

Yumi Kanemitsu

Noboru Uenishi

Toshihiko Takiguchi

Shinji Kikuhara

Toshinori Sakamaki

The present invention provides a conductive paste comprising flake conductive fillers having a 99% cumulative particle size of 25 &#x3bc;m or less and a binder resin as essential components. The flake conductive fillers are metal particles having a silver-copper alloy surface layer. The conductive paste according to the present invention is fused with a part of a copper foil circuit to which the conductive paste is to be connected during connection by heating and pressurization, and has high electrical conductivity and high fill ration in a via hole. Thus, the conductive paste according to the present invention provides a multilayer printed wiring board that has high reliability of connection and excellent interlayer connection.

Conductive paste and multilayer printed wiring board using the same

There is provided a conductive paste obtained by kneading conductive particles into an epoxy resin and having good filling ability into a via hole, which can form a connected portion wherein the connection resistance does not change with time even under high temperature and high humidity conditions. Also, there is provided a method for manufacturing a multilayer printed wiring board using the conductive paste. A conductive paste containing conductive particles and a resin mixture wherein the content of the epoxy resin having a molecular weight of 10,000 or more is from 30 to 90% by weight in the total resin component and whose elastic modulus at 85&#xb0; C. after curing is 2 GPa or less, the content of the conductive particle being from 30 to 75% by volume. Furthermore, a method for manufacturing a multilayer printed wiring board using the conductive paste.

Conductive paste and method for manufacturing multilayer printed wiring board using the same

A high specific-gravity EPDM composition consisting of a mixture of EPDM containing diene at less than 4.5 wt % and ethylene at not less than 58 wt % nor more than 80 wt % and having a Mooney viscosity MLnot less than 50 nor more than 170 at 125&#xb0; C. and a powdery material, containing powder whose specific gravity is not less than 12 as a main component thereof, added to the EPDM at not less than 80 wt % nor more than 97.5 wt % of a whole amount of the high specific-gravity EPDM composition.

High-specific-gravity EPDM composition, dynamic damper made from the composition, tennis racket with the dynamic damper, and radiation-shielding material comprising the composition

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Osaka, Japan

Hitoshi Takii