Shizuoka, Japan

Hitoshi Shimbo

USPTO Granted Patents = 12 


Average Co-Inventor Count = 3.4

ph-index = 5

Forward Citations = 55(Granted Patents)


Location History:

  • Sunto-gun, JP (2004)
  • Sunto, JP (2008)
  • Shizuoka-ken, JP (2008)
  • Shizuoka, JP (2001 - 2013)

Company Filing History:


Years Active: 2001-2013

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12 patents (USPTO):Explore Patents

Title: Innovations by Hitoshi Shimbo: Pioneering Heat-Sensitive Technologies

Introduction: Hitoshi Shimbo is an accomplished inventor based in Shizuoka, Japan, known for his significant contributions to the field of heat-sensitive adhesives and recording mediums. With a remarkable portfolio of 12 patents, Shimbo's work has notably advanced the technology used in various applications.

Latest Patents: Among his latest innovations are the heat-sensitive adhesive agent and heat-sensitive adhesive sheet, which incorporates a thermoplastic resin and a heat-meltable substance that melts upon heating, along with swellable mica. Another noteworthy invention is the reversible thermosensitive recording medium, which is a crucial development in improving image processing methods and offers versatility in recording technologies.

Career Highlights: Hitoshi Shimbo has made substantial contributions to Ricoh Company, Ltd., where his work has driven advancements in heat-sensitive technologies. His multiple patents not only reflect his innovative spirit but also highlight his commitment to enhancing the capabilities of recording and adhesive materials.

Collaborations: Throughout his career, Shimbo has collaborated with talented coworkers such as Kunio Hayakawa and Shinya Kawahara. These partnerships have fostered a collaborative environment, leading to groundbreaking innovations in their respective fields.

Conclusion: Hitoshi Shimbo stands out as a prominent figure in the realm of innovation, particularly for his work with heat-sensitive technologies. His patented inventions not only illustrate his expertise but also carry significant implications for industries relying on advanced adhesive and recording solutions.

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