Hitoshi Hosokawa

Title: Hitoshi Hosokawa: Innovator in Resin Composition Technology

Introduction

Hitoshi Hosokawa is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of resin compositions, particularly in developing materials with enhanced electrical properties. His work is recognized for its innovative approach to combining various components to achieve desired outcomes in cured products.

Latest Patents

Hitoshi Hosokawa holds a patent for a resin composition, method for forming a cured product, and the cured product itself. The patent describes a resin composition that includes copper particles and a specific resin, which enables the production of a cured product with a low volume resistance value. The composition consists of copper particles with an average diameter ranging from 0.1 to 20 μm, a phosphoric acid-modified epoxy resin, and a curing agent. The proportions of these components are carefully defined to ensure optimal performance.

Career Highlights

Hitoshi Hosokawa is associated with Adeka Corporation, where he has been instrumental in advancing resin technology. His expertise in material science has led to the development of innovative solutions that meet the demands of various industries. His patent reflects his commitment to enhancing the functionality of resin compositions.

Collaborations

Hitoshi has collaborated with notable colleagues, including Yusuke Nuida and Hiroshi Morita. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Hitoshi Hosokawa's contributions to resin composition technology exemplify the impact of innovative thinking in material science. His patent showcases the potential for advancements in the field, paving the way for future developments.