The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 20, 2024

Filed:

Aug. 11, 2020
Applicant:

Adeka Corporation, Tokyo, JP;

Inventors:

Yusuke Nuida, Tokyo, JP;

Hitoshi Hosokawa, Tokyo, JP;

Hiroshi Morita, Tokyo, JP;

Assignee:

ADEKA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08K 3/08 (2006.01); C08G 59/14 (2006.01); C08G 59/30 (2006.01); C08G 59/32 (2006.01); C08G 59/62 (2006.01); C08G 59/68 (2006.01); C08L 63/00 (2006.01); C08L 101/00 (2006.01);
U.S. Cl.
CPC ...
C08K 3/08 (2013.01); C08G 59/1488 (2013.01);
Abstract

The present invention provides a resin composition that contains copper particles and a particular resin and that is capable of producing a cured product having a low volume resistance value, and a cured product obtained by curing the resin composition. The resin composition contains (A) copper particles having an average particle diameter of 0.1 to 20 μm, (B) a phosphoric acid-modified epoxy resin obtained by reacting a phosphoric acid (b1) with an epoxy compound (b2), and (C) a curing agent, wherein the content of the component (B) and the content of the component (C), based on 100 parts by mass of the total amount of the components (A) to (C), are 0.1 to 30 parts by mass and 0.1 to 5 parts by mass, respectively. Further, the cured product is obtained by curing the resin composition.


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