Tokyo, Japan

Hitoshi Hoshino

USPTO Granted Patents = 4 

 

Average Co-Inventor Count = 2.1

ph-index = 2

Forward Citations = 23(Granted Patents)


Company Filing History:


Years Active: 1993-2003

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4 patents (USPTO):Explore Patents

Title: Hitoshi Hoshino: Innovator in LSI Packaging Technology

Introduction

Hitoshi Hoshino is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of LSI (Large Scale Integration) packaging technology. With a total of four patents to his name, Hoshino's work has advanced the efficiency and effectiveness of electronic components.

Latest Patents

Hitoshi Hoshino's latest patents include innovative methods for LSI packages. One of his notable inventions is an LSI package and internal connecting method that eliminates the need for solder bumps on bare chips. This invention allows for the mounting of a bare chip on the LSI package by forming wiring patterns that connect to the chip's I/O terminals within a build-up layer of the substrate. Additionally, the wiring patterns are designed to connect to the outer I/O terminals on the substrate, enhancing the overall functionality of the package.

Another significant patent by Hoshino is the LSI package with internal wire patterns that facilitate the connection and mounting of bare chips to substrates. This invention also avoids the traditional soldering process, streamlining the manufacturing process and improving reliability.

Career Highlights

Throughout his career, Hitoshi Hoshino has worked with notable companies such as NEC Corporation and Advanced Space Communications Research Laboratory. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking advancements in technology.

Collaborations

Hoshino has collaborated with esteemed colleagues, including Tomiji Sato and Atsushi Taga. These partnerships have fostered a creative environment that has led to innovative solutions in the field of LSI packaging.

Conclusion

Hitoshi Hoshino's contributions to LSI packaging technology have made a lasting impact on the industry. His innovative patents and collaborative efforts with leading companies and colleagues highlight his dedication to advancing electronic component technology.

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