Nec Corporation

Advanced Space Communications Research Laboratory

Disco Corporation

Namiki Seimitsu Houseki Kabushiki Kaisha

Hitoshi Hoshino

Hiroyuki Arai

Takashi Miyoshi

Hideo Aida

Atsushi Taga

Natsuko Aota

Tomiji Sato

Yuichi Otsu

The present invention is provides an LSI package without employing steps for forming solder bumps on a bare chip and soldering to an interposer. In the present invention, a bare chip is mounted on the LSI package by forming wiring patterns which connect to bare chip I/O terminals in a build-up layer of a substrate. Furthermore, the wiring patterns are formed so as to connect outer I/O terminals on the substrate.

LSI package and internal connecting method used therefor

LSI package with internal wire patterns to connect and mount bare chip to substrate

A hand-held satellite mobile phone terminal contains an antenna deployment element with a small antenna attached to the tip area of the antenna deployment element The antenna deployment element is usually folded and stored on the rear side surface of the body of the hand-held satellite mobile phone terminal, and is deployed to become vertical to the rear side surface of the hand-held satellite mobile phone terminal body when it is used. The antenna deployment element is attached to the body of the hand-held satellite mobile phone terminal through a rotational axis so that the small antenna attached to the antenna deployment element can be rotated after deployment in order for its plane to become parallel with the ground surface. Also, the hand-held satellite mobile phone terminal is usable both in a satellite communication system and in a terrestrial cellular communication system. For this purpose, the antenna deployment element, batteries and circuits for satellite communication are installed as one package, which can be folded and stored on the rear side surface of the body of the hand-held mobile phone terminal, and which can be removed freely so that it is replaced by another package having the same attachment size as the one package and containing only batteries, when the hand-held mobile phone terminal is used in a terrestrial mobile communication system.

Hand-held mobile phone terminal

A semiconductor chip 4 is fixed to an island portion 16 of a lead frame, an electrode pad 22 of the semiconductor chip and the inner end portion of an external lead 18 of the lead frame are connected with an electrically conductive thin wire 24 and the semiconductor chip 4 is sealed with plastic together with the island portion 16 and the inner end portion of the external lead 18. The external lead 18 is cut off and isolated from the frame portion 12 and, with the island portion 16 retained by the frame portion 12 via a connecting portion 14, the external lead 18 is made to contact a measuring terminal 10 of the testing machine to carry out the electrical characteristic test of the semiconductor chip 4. Thereafter, the connecting portion 14 is cut off to remove the frame portion 12. After the removal, or simultaneously with that, the external lead 18 may be formed. According to this method, since the external lead is left rectilinear and, separated from the external lead, the frame portion is attached to carry out the test, the danger of the external lead being deformed is remarkably small and, further, the electrical contact with the test can be excellently maintained.

Method of manufacturing a semiconductor device

Growing community of inventors

Tokyo, Japan

Hitoshi Hoshino