Yokkaichi, Japan

Hisayuki Nozawa


Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 15(Granted Patents)


Company Filing History:


Years Active: 2014

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1 patent (USPTO):Explore Patents

Title: Hisayuki Nozawa: Innovator in Wire Technology

Introduction

Hisayuki Nozawa is a prominent inventor based in Yokkaichi, Japan. He is known for his innovative contributions to the field of wire technology, particularly in the context of 3D memory arrays. His work has significantly impacted the way electrical connections are formed in advanced memory systems.

Latest Patents

Hisayuki Nozawa holds a patent for a method of inhibiting wire collapse. This technique prevents wire flaking and collapse, which is crucial for maintaining the integrity of electrical connections. One aspect of his patent involves an improved method of forming wires over trenches located in the hookup region of a 3D memory array. The trenches are formed between CMP dummy structures and are partially filled with a flowable oxide film. This process leaves a gap in the trench that is at least as wide as the total pitch of the wires to be formed. A capping layer is then created over the flowable film, and after forming a conductive layer over the dielectric layer, the conductive layer is etched to create conductive wires. This innovative approach allows for temporary support of the conductive wires by lines of material formed from the capping layer.

Career Highlights

Hisayuki Nozawa is currently employed at Sandisk 3D LLC, where he continues to develop cutting-edge technologies in the field of memory storage. His expertise in wire technology has made him a valuable asset to the company and the industry as a whole.

Collaborations

Throughout his career, Nozawa has collaborated with notable colleagues, including Chao Feng Yeh and Hiroaki Iuchi. These partnerships have fostered innovation and contributed to advancements in memory technology.

Conclusion

Hisayuki Nozawa's contributions to wire technology and memory systems exemplify the importance of innovation in the tech industry. His patent for inhibiting wire collapse showcases his commitment to improving the reliability of electrical connections in 3D memory arrays. His work continues to influence the future of memory technology.

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