Higashiosaka, Japan

Hisatoshi Murakami



Average Co-Inventor Count = 4.2

ph-index = 7

Forward Citations = 144(Granted Patents)


Location History:

  • Osaka, JP (1998 - 1999)
  • Higashiosaka, JP (1988 - 2007)

Company Filing History:


Years Active: 1988-2007

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9 patents (USPTO):Explore Patents

Title: Hisatoshi Murakami: A Pioneer in Conductive Paste Innovations

Introduction:

Hisatoshi Murakami, an esteemed inventor hailing from Higashiosaka, Japan, has made significant contributions to the field of conductive materials. With a remarkable portfolio of nine patents, he has developed innovative solutions that enhance the performance and reliability of electronic devices. His work is characterized by a blend of creativity and technical expertise, addressing crucial challenges in modern technology.

Latest Patents:

Among Hisatoshi Murakami's latest inventions is a ground-breaking development in conductive paste for multilayered boards. This conductive paste boasts excellent conductivity and adhesiveness to substrates, alongside a unique formulation that ensures long-lasting stability. Notably, it improves the reliability of bonding in through-holes of multi-layered substrates, eliminating the need for through-hole plating. The formulation includes a combination of an acrylate resin, epoxy resin, a metal powder from at least two different metals, a phenol-type curing agent, and a flux to enhance the bonding process.

Another significant patent pertains to an electroconductive coating composition for printed circuit boards. This invention emphasizes a flexure-resistant, electromagnetic-shielded flexible printed circuit assembly, which is created by forming a copper foil circuit on a heat-resistant plastic film. The design strategically incorporates layers that enhance the electrical connectivity and shielding properties, ultimately improving the overall efficiency of electronic devices.

Career Highlights:

Hisatoshi Murakami's career is marked by his association with several renowned companies. He has played pivotal roles at Tatsuta Electric Wire & Cable Co., Ltd. and Nintendo Co., Ltd., contributing his innovative ideas and expertise to enhance product offerings. His commitment to research and development has positioned him as a key figure in the evolution of conductive materials.

Collaborations:

Throughout his career, Murakami has collaborated with talented individuals such as Tsunehiko Terada and Shinichi Wakita. These partnerships have fostered a creative environment where innovative ideas thrive, allowing for the successful development of groundbreaking technologies.

Conclusion:

Hisatoshi Murakami continues to be a significant contributor to the advancements in conductive paste technology. His patents reflect a deep understanding of materials science and engineering, making a lasting impact on the electronics industry. As technology evolves, Murakami's inventions will undoubtedly play a crucial role in shaping the future of electronic devices.

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