The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 1989
Filed:
Mar. 12, 1987
Katsuya Nakagawa, Kyoto, JP;
Kazumasa Eguchi, Higashiosaka, JP;
Fumio Nakatani, Higashiosaka, JP;
Shinichi Wakita, Higashiosaka, JP;
Hisatoshi Murakami, Higashiosaka, JP;
Tsunehiko Terada, Higashiosaka, JP;
Nintendo Co., Ltd., Kyoto, JP;
Tatsuta Electric Wire & Cable Co., Osaka, JP;
Abstract
A printed circuit board capable of preventing electromagnetic interference comprises a base plate composed of an insulating material. On the main surface of the base plate, a first electric conductive layer is formed by etching copper foil, which includes a signal electrode portion and a ground electrode portion. On the first electric conductive layer, an insulating layer such as a solder resist film is formed except for a part of the ground electrode portion, and on this layer, a second electric conductive layer is formed by screen-printing a copper ink so as to cover almost all of the first electric conductive layer. A part of the second electric conductive layer is connected to the ground electrode portion of the first electric conductive layer so that the second electric conductive layer acts as an electromagnetic shield. The copper ink is a mixture of copper powder, binder and other materials. A solder layer may be formed on the second electric conductive layer composed of the copper ink.