Company Filing History:
Years Active: 2000
Title: Hisato Matsubara: Innovator in CMP Apparatus Technology
Introduction
Hisato Matsubara is a notable inventor based in Ayase, Japan. He has made significant contributions to the field of semiconductor manufacturing, particularly in the development of carrier and chemical mechanical polishing (CMP) apparatus technology. His innovative approach has led to advancements that enhance the efficiency and effectiveness of wafer polishing processes.
Latest Patents
Hisato Matsubara holds a patent for a carrier and CMP apparatus designed to improve the uniformity of polishing in wafers and other workpieces. This invention aims to increase the margin of wear on the retainer ring, thereby enhancing the operational rate of the CMP apparatus. The carrier consists of several components, including a housing, carrier base, retainer ring, sheet supporter, hard sheet, and soft backing sheet. The design incorporates a pressure chamber that ensures uniform pressure is applied to the wafer, countering fluctuations caused by wear on the retainer ring.
Career Highlights
Matsubara has been associated with Speedfam Co Ltd, where he has played a crucial role in advancing CMP technology. His work has been instrumental in improving the manufacturing processes used in the semiconductor industry. His innovative designs have contributed to the efficiency and reliability of wafer polishing, making a significant impact on the field.
Collaborations
Hisato Matsubara has collaborated with notable colleagues, including Hatsuyuki Arai and Shigeto Izumi. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas within the industry.
Conclusion
Hisato Matsubara's contributions to CMP apparatus technology exemplify the spirit of innovation in the semiconductor manufacturing sector. His patent and collaborative efforts continue to influence the industry, paving the way for future advancements.