Company Filing History:
Years Active: 2004-2010
Title: Hisashige Nishida: Innovator in Semiconductor Technology
Introduction
Hisashige Nishida is a prominent inventor based in Yamatokoriyama, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on enhancing the performance and reliability of semiconductor devices.
Latest Patents
Nishida's latest patents include innovative designs for semiconductor devices. In one of his patents, he describes a semiconductor device where a semiconductor chip is stacked on a substrate. An interposer chip with wirings is positioned beneath the semiconductor chip. This design allows for the bonding pad of the semiconductor chip to be electrically connected to a bonding terminal on the substrate via the interposer chip through wire bonding. The interposer chip plays a crucial role in preventing the semiconductor element from deteriorating in terms of electric properties and physical damage. Additionally, it ensures that the wire bonding strength remains intact while allowing for a fine wiring pitch for relaying a wire-bonding wire.
Career Highlights
Nishida is currently associated with Sharp Kabushiki Kaisha Corporation, where he continues to innovate in semiconductor technology. His expertise and contributions have positioned him as a key figure in the industry.
Collaborations
Some of his notable coworkers include Yoshiki Sota and Hiroyuki Juso, who collaborate with him on various projects within the company.
Conclusion
Hisashige Nishida's work in semiconductor technology exemplifies innovation and dedication to improving electronic devices. His patents reflect a commitment to advancing the field and ensuring the reliability of semiconductor components.