The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 11, 2004

Filed:

Feb. 21, 2003
Applicant:
Inventors:

Kiyomi Taniguchi, Ikoma-gun, JP;

Hisashige Nishida, Yamatokoriyama, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/348 ;
U.S. Cl.
CPC ...
H01L 2/348 ;
Abstract

A semiconductor device comprising: a substrate; first and second interconnection patterns respectively provided on upper and lower surfaces of the substrate; a through-hole electrode extending through the substrate for electrically connecting the first and second interconnection patterns; a semiconductor chip provided on the upper surface of the substrate and electrically connected to the first interconnection pattern; and a resist film covering the second interconnection pattern; the second interconnection pattern comprising a generally round land and a lead interconnection portion extending from the land, the resist film having an opening formed therein for exposing the entire land, the opening having a curved edge surrounding a peripheral edge of the land and a linear edge linearly extending along a boundary between the land and the lead interconnection portion, the exposed land having a solder ball as an external terminal thereon.


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