Tokyo, Japan

Hisashi Tomiya

This inventor holds 1 USPTO granted patent. Top assignee: Shinagawa Refractories Co., Ltd.. Active years: 2011.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hisashi Tomiya. Retrieved from https://idiyas.com/inventor/hisashi-tomiya

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 11(Granted Patents)


Company Filing History:


Years Active: 2011

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1 patent (USPTO):Explore Patents

Title: Hisashi Tomiya and Refractory Brick Innovation.

Introduction

Hisashi Tomiya is an inventor associated with Tokyo, Japan, and Shinagawa Refractories Co., Ltd. His patent work concerns refractory materials designed for demanding steelmaking applications.

Latest Patents

Tomiya is credited with 1 patent, titled “Refractory brick.” The invention describes a refractory brick intended to provide durability comparable to alumina-magnesia castable materials, with particular suitability for steelmaking ladles. It is made from alumina and magnesia raw materials, press-molded and heat-treated at temperatures from 100°C to 1,150°C. The specified composition includes at least 90% by mass of alumina and magnesia combined, 4–16% magnesia, 0.5–5% silica, and 0.3–2% sodium oxide and potassium oxide combined, with the balance consisting of alumina and unavoidable impurities.

Career Highlights

Tomiya’s documented patent highlights his contribution to refractory-brick technology for steel production. The invention focuses on material composition and processing conditions intended to support durability in ladle service.

Collaborations

Tomiya is associated with Shinagawa Refractories Co., Ltd. His listed coworkers include Ryosuke Nakamura and Hiroyuki Shikama.

Conclusion

Hisashi Tomiya’s patent reflects an engineering approach to improving refractory-brick durability for steelmaking ladles through carefully specified materials and manufacturing conditions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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