Tsushima, Japan

Hisashi Terayama

This inventor holds 2 USPTO granted patents. Top assignee: Tokai Rubber Industries, Ltd.. Active years: 2013.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hisashi Terayama. Retrieved from https://idiyas.com/inventor/hisashi-terayama

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 50.0

Average Co-Inventor Count = 5.0

ph-index = 2

Forward Citations = 17(Granted Patents)


Company Filing History:


Years Active: 2013

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2 patents (USPTO):Explore Patents

Title: Hisashi Terayama: Innovator in Quick Connector Technology

Introduction

Hisashi Terayama is a notable inventor based in Tsushima, Japan. He has made significant contributions to the field of quick connector technology, holding 2 patents that showcase his innovative approach to engineering solutions.

Latest Patents

His latest patents include a quick connector designed to ensure that a pipe body is securely engaged by a retainer. This invention features elastically-deformable claws that are arranged adjacently in an axial direction. The claws are flexibly deformable, allowing them to maintain engagement with a second engagement portion of the retainer body. This design regulates sliding from a first position toward a set radial direction, enhancing the reliability of the connection.

Career Highlights

Hisashi Terayama is currently employed at Tokai Rubber Industries, Ltd., where he continues to develop innovative solutions in the field of connectors. His work has been instrumental in advancing the technology used in various applications.

Collaborations

He collaborates with talented coworkers, including Hiroshi Yamada and Kazushige Sakazaki, who contribute to the innovative environment at Tokai Rubber Industries.

Conclusion

Hisashi Terayama's contributions to quick connector technology reflect his dedication to innovation and engineering excellence. His patents not only enhance the functionality of connectors but also demonstrate the importance of collaboration in the field of invention.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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