Hyogo, Japan

Hisashi Ichikawa


Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2019

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1 patent (USPTO):Explore Patents

Title: Hisashi Ichikawa: Innovator in Hot Melt Adhesives

Introduction

Hisashi Ichikawa is a notable inventor based in Hyogo, Japan. He has made significant contributions to the field of adhesive technology, particularly through his innovative work on hot melt adhesives. His expertise and creativity have led to the development of unique formulations that enhance the performance of adhesives in various applications.

Latest Patents

Ichikawa holds 1 patent for a hot melt adhesive. This invention includes a thermoplastic polymer and a tackifier, where the tackifier is modified by at least one of maleic acid and maleic anhydride. Additionally, it incorporates at least one component selected from a group consisting of acrylic acid, methacrylic acid, an acrylic acid ester, and a methacrylic acid ester. This innovative approach improves the adhesive properties and versatility of the product.

Career Highlights

Ichikawa is currently associated with Moresco Corporation, a company known for its advanced adhesive solutions. His work at Moresco has allowed him to apply his inventive skills in a practical setting, contributing to the company's reputation for quality and innovation in adhesive products.

Collaborations

Ichikawa has collaborated with talented coworkers such as Hiroshi Kurokawa and Maki Samitsu. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge adhesive technologies.

Conclusion

Hisashi Ichikawa's contributions to the field of hot melt adhesives exemplify the impact of innovation in industrial applications. His work continues to influence the adhesive industry, showcasing the importance of creativity and collaboration in driving technological advancements.

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