This inventor holds 1 USPTO granted patent. Top assignee: Murata Manufacturing Co., Ltd.. Active years: 2004.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2004
Title: Hisamitsu Kamenaga: Innovator in Wire Bonding Technology
Introduction
Hisamitsu Kamenaga is a notable inventor based in Ishikawa, Japan. He has made significant contributions to the field of wire bonding technology, particularly through his innovative methods that enhance the reliability and efficiency of electronic connections.
Latest Patents
Kamenaga holds a patent for a wire bonding method that involves ultrasonically joining two connecting electrodes with a wire. This method includes the formation of at least one of the connecting electrodes with tantalum and utilizes a wire that has a fracture load of about 21 g or greater, or a fracture stress of 290 N/mm or greater. This innovation is crucial for improving the performance of electronic devices.
Career Highlights
Hisamitsu Kamenaga is associated with Murata Manufacturing Co., Ltd., a leading company in the electronics industry. His work at Murata has allowed him to focus on advancing technologies that are essential for modern electronic applications.
Collaborations
Kamenaga has collaborated with notable colleagues such as Norihiko Takada and Shingo Iwasa. Their combined expertise has contributed to the development of cutting-edge technologies in the field.
Conclusion
Hisamitsu Kamenaga's contributions to wire bonding technology exemplify the importance of innovation in the electronics industry. His work continues to influence advancements in electronic device manufacturing.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile