Tokyo, Japan

Hisahito Inagawa

This inventor holds 1 USPTO granted patent. Top assignee: Koike Sanso Kogyo Co., Ltd.. Active years: 2004.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hisahito Inagawa. Retrieved from https://idiyas.com/inventor/hisahito-inagawa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 28(Granted Patents)


Company Filing History:


Years Active: 2004

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1 patent (USPTO):Explore Patents

Title: Hisahito Inagawa: Innovator in Laser Piercing Technology

Introduction

Hisahito Inagawa is a prominent inventor based in Tokyo, Japan. He is known for his innovative contributions to laser technology, particularly in the field of laser piercing methods. His work has significantly impacted the efficiency and effectiveness of piercing processes in various applications.

Latest Patents

Inagawa holds a patent for a laser piercing method, which aims to reduce the time required for piercing a workpiece while ensuring the formation of a satisfactory pierced hole. This method involves adjusting the nozzle level, assist gas pressure, and focal point of the laser beam during the piercing process to optimize performance. The invention enhances the overall efficiency of laser cutting and piercing operations.

Career Highlights

Inagawa is associated with Koike Sanso Kogyo Co., Ltd., a company renowned for its advancements in cutting and welding technologies. His role at the company has allowed him to develop and refine his innovative ideas, contributing to the company's reputation in the industry.

Collaborations

Inagawa collaborates with Akira Furujo, a fellow innovator, to further enhance their research and development efforts in laser technology. Their partnership exemplifies the importance of teamwork in driving innovation.

Conclusion

Hisahito Inagawa's contributions to laser piercing technology demonstrate his commitment to innovation and efficiency. His patent reflects a significant advancement in the field, showcasing the potential for improved manufacturing processes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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