Company Filing History:
Years Active: 2015-2016
Title: Innovations by Hiroyuki Yasuyoshi
Introduction
Hiroyuki Yasuyoshi is a notable inventor based in Kanazawa, Japan. He has made significant contributions to the field of bonding devices, holding a total of four patents. His work focuses on enhancing the efficiency and effectiveness of electronic component bonding processes.
Latest Patents
One of Yasuyoshi's latest patents is a bonding device that features a light guiding part designed to direct a laser beam from a laser oscillator. This device includes a bonding head that utilizes the laser beam to heat a chip, along with a bonding head moving part that transitions the bonding head between a supply position and a bonding position. The innovative design separates the laser oscillator from the bonding head, allowing for improved functionality. The light guiding part consists of an irradiation barrel located near the bonding position, a shutter part within the irradiation barrel, and a light receiving part on the bonding head that channels the laser beam to the chip. When the bonding head is moved to the bonding position, the shutter part opens, enabling the laser beam to reach the bonding head through the light receiving part.
Another significant patent involves a bonding head equipped with a tool base within a housing. This bonding head is designed to transmit a laser beam that heats an electronic component, facilitating its bonding to a substrate. A heat-radiating member is in contact with the tool base, allowing for efficient heat management. This member has a higher thermal conductivity than the tool base, ensuring that heat escapes rapidly during the bonding process, thus enhancing the overall efficiency of the device.
Career Highlights
Hiroyuki Yasuyoshi is currently employed at Shibuya Kogyo Co., Ltd., where he continues to innovate and develop advanced bonding technologies. His expertise in laser applications and thermal management has positioned him as a key figure in the industry.
Collaborations
Yasuyoshi collaborates with Eiji Tanaka, contributing to the development of cutting-edge bonding solutions. Their partnership has led to advancements in the efficiency and effectiveness of electronic component bonding.
Conclusion
Hiroyuki Yasuyoshi's contributions to the field of bonding devices demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of technology and its applications in electronics.