The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2015

Filed:

Jun. 06, 2013
Applicants:

Eiji Tanaka, Kanazawa, JP;

Hiroyuki Yasuyoshi, Kanazawa, JP;

Inventors:

Eiji Tanaka, Kanazawa, JP;

Hiroyuki Yasuyoshi, Kanazawa, JP;

Assignee:

SHIBUYA KOGYO CO., LTD., Kanazawa-shi, Ishikawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/00 (2006.01); B23K 26/00 (2014.01); B23K 26/20 (2014.01); B23K 26/22 (2006.01); H01L 23/00 (2006.01); H01L 21/58 (2006.01); H01L 21/60 (2006.01);
U.S. Cl.
CPC ...
B23K 26/22 (2013.01); B23K 1/00 (2013.01); B23K 26/00 (2013.01); H01L 24/75 (2013.01); B23K 26/20 (2013.01); H01L 21/58 (2013.01); H01L 24/81 (2013.01); H01L 2021/6003 (2013.01); H01L 2021/60112 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/75262 (2013.01); H01L 2224/75702 (2013.01); H01L 2224/75745 (2013.01); H01L 2224/81024 (2013.01); H01L 2224/81224 (2013.01);
Abstract

A chip attraction passageis provided extending through a housingA, a tool base, and a bonding tool. When the chip attraction passageis attracted by the vacuum source, a semiconductor chipcan be attracted to and held on the lower surface of the bonding tool. The tool baseis configured by laminating transmitting membersand. A connection passage, which is a main part of the chip attraction passage, is configured by a grooveB formed on the upper surface of the transmitting memberand a through-holeA in the center of the transmitting member. When the semiconductor chipis heated by laser beams L and bonded to a substrate, even if flux or the like adhering to bumpstranspires and adheres in the connection passage


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