Osaka, Japan

Hiroyuki Yamabe

This inventor holds 1 USPTO granted patent. Top assignee: Toho Kinzoku Co., Ltd.. Active years: 1999.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hiroyuki Yamabe. Retrieved from https://idiyas.com/inventor/hiroyuki-yamabe

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 1999

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1 patent (USPTO):Explore Patents

Title: Hiroyuki Yamabe: Innovator in Copper-Tungsten Alloys

Introduction

Hiroyuki Yamabe is a notable inventor based in Osaka, Japan. He has made significant contributions to the field of materials science, particularly in the development of copper-tungsten alloys. His innovative work has led to advancements in manufacturing methods that are crucial for various industrial applications.

Latest Patents

Hiroyuki Yamabe holds 1 patent for his invention related to copper-tungsten alloys and their manufacturing methods. This patent showcases his expertise in creating materials that combine the beneficial properties of both copper and tungsten, which are essential for high-performance applications.

Career Highlights

Yamabe is currently employed at Toho Kinzoku Co., Ltd., where he continues to push the boundaries of material innovation. His work at the company has positioned him as a key player in the development of advanced materials that meet the demands of modern technology.

Collaborations

Throughout his career, Hiroyuki Yamabe has collaborated with talented individuals such as Naoyoshi Akiyoshi and Kimio Nakada. These partnerships have fostered a creative environment that encourages the exchange of ideas and the pursuit of groundbreaking innovations.

Conclusion

Hiroyuki Yamabe's contributions to the field of copper-tungsten alloys exemplify the impact of dedicated inventors in advancing material science. His work not only enhances industrial processes but also paves the way for future innovations in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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