Hiroyuki Wakasa

Title: Hiroyuki Wakasa: Innovator in Coated Paper and Circuit Board Technologies

Introduction

Hiroyuki Wakasa is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the fields of coated paper and printed circuit board technologies. With a total of 2 patents, his work showcases innovative solutions that enhance product quality and functionality.

Latest Patents

Wakasa's latest patents include a coated paper sheet that features a coating layer formed on a paper sheet substrate. This layer contains a pigment and a binder, and optionally a pre-coated polyacrylamide-containing anionic acrylic resin layer. The coated paper exhibits a 75° specular gloss of 70% or more, an air permeability of 4000 seconds or less, and a Clark stiffness of 12 cm or more in the cross direction. Additionally, it has an internal bond strength of 200 mJ or more, making it highly resistant to blistering and excellent for both offset printing and electrophotographic duplicating or printing. Another notable patent is for a printed circuit board that connects electric circuit forming elements and conductors without the use of intercrossed connection wires, streamlining the design and enhancing performance.

Career Highlights

Throughout his career, Wakasa has worked with notable companies such as Oji Paper Co., Ltd. and Canon Inc. His experience in these organizations has allowed him to develop and refine his innovative ideas, contributing to advancements in technology.

Collaborations

Wakasa has collaborated with talented individuals in his field, including Harumi Watanabe and Atsushi Myojo. These partnerships have fostered a creative environment that encourages the exchange of ideas and expertise.

Conclusion

Hiroyuki Wakasa's contributions to coated paper and printed circuit board technologies highlight his innovative spirit and dedication to improving product quality. His patents reflect a commitment to excellence and a forward-thinking approach in the realm of technology.