Company Filing History:
Years Active: 2002
Title: Hiroyuki Tsukui: A Pioneer in Semiconductor Technology
Introduction: Hiroyuki Tsukui, an innovative inventor based in Tokyo, Japan, has made significant contributions to the field of semiconductor technology. With a focus on improving the manufacturing process of semiconductor devices, Tsukui has developed innovative solutions that enhance efficiency and performance.
Latest Patents: One of Tsukui's notable patents is titled "Method of forming solder bumps on a semiconductor device using bump transfer plate." This invention involves a bump formation plate equipped with a base and solder bumps formed on the base. The design features solder bumps that incline from the center to the periphery, with a flat contact surface against the base. This innovative approach optimizes the manufacturing process, using materials such as aluminum or stainless steel for the base.
Career Highlights: Hiroyuki Tsukui is associated with NEC Corporation, a leading company in semiconductor technology. His work at NEC has allowed him to push the boundaries of current technologies. With only one patent to his name so far, it is clear that his ingenuity and insight into semiconductor manufacturing processes have made a significant impact on the industry.
Collaborations: Throughout his career, Tsukui has collaborated with other talented individuals in the field. Notably, he has worked alongside colleagues such as Chikara Yamashita and Tetsuya Tao. These collaborations have fostered a creative environment that has furtheranalyzed and supported innovative advancements within the company.
Conclusion: Hiroyuki Tsukui's contributions to semiconductor technology through his innovative patent reflect a dedication to enhancing manufacturing practices. His work at NEC Corporation and collaborations with esteemed colleagues position him as an influential inventor in the industry, paving the way for future innovations in semiconductor device fabrication.