Seto, Japan

Hiroyuki Oya

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Opton Co., Ltd.. Active years: 2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hiroyuki Oya. Retrieved from https://idiyas.com/inventor/hiroyuki-oya-ik57193e

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0


Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2020

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1 patent (USPTO):Explore Patents

Title: Hiroyuki Oya: Innovator in Bending Device Technology

Introduction

Hiroyuki Oya is a notable inventor based in Seto, Japan, recognized for his contributions to the field of robotics and manufacturing technology. With a strong focus on automation and precision engineering, Oya has developed innovative solutions that enhance the capabilities of modern machinery.

Latest Patents

Oya holds one patent, which is for a bending device designed to improve the efficiency and accuracy of bending workpieces. The bending device features a track system that extends in a predetermined direction, with two movable bases equipped with multi-articulated robots. Each robot has a sophisticated bending mechanism, allowing for the gripping and bending of materials with precision. This invention represents a significant advancement in robotic automation for manufacturing processes.

Career Highlights

Hiroyuki Oya works at Opton Co., Ltd., a company dedicated to developing advanced technological solutions. His expertise in robotics and innovation is a valuable asset to the organization, where he has contributed to various projects that push the boundaries of what is possible in industrial automation.

Collaborations

Oya collaborates closely with his coworker, Teruaki Yogo, to drive innovation at Opton Co., Ltd. Together, they explore new ideas and implement cutting-edge technologies that improve workpiece handling and processing in manufacturing environments. Their teamwork exemplifies the synergy needed to tackle complex engineering challenges.

Conclusion

Hiroyuki Oya's work in developing a bending device showcases his inventive spirit and commitment to advancing technology. His patent not only highlights his skills as an engineer but also his potential to influence the future of robotics in manufacturing. Oya's contributions reflect the ongoing pursuit of innovation in the industrial sector, paving the way for more efficient manufacturing processes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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