Kawanishi, Japan

Hiroyuki Onishi


Average Co-Inventor Count = 6.0

ph-index = 2

Forward Citations = 6(Granted Patents)


Location History:

  • Kurashiki, JP (1989)
  • Kawanishi, JP (1990)

Company Filing History:


Years Active: 1989-1990

Loading Chart...
2 patents (USPTO):Explore Patents

Title: Innovations by Hiroyuki Onishi in Corrugated Board Production

Introduction

Hiroyuki Onishi, an inventive mind located in Kawanishi, Japan, has made significant contributions to the field of adhesive technology, particularly in the production of corrugated board. With a total of two patents to his name, Onishi's inventions demonstrate a commitment to enhancing industrial processes through innovative solutions.

Latest Patents

Hiroyuki Onishi's latest patents focus on the development of adhesives that are integral for the production of corrugated board. The first patent introduces a process utilizing an aqueous adhesive that contains polyvinyl alcohol, clay, and, in some cases, a water-soluble boron compound. The specifics of the formulation detail the ratio of clay to polyvinyl alcohol, which ranges from 200 to 600 parts by weight based on 100 parts of polyvinyl alcohol, and limits the water-soluble boron compound to no more than 15 parts by weight based on 100 parts of polyvinyl alcohol. Additionally, the solid content of the adhesive is characterized as being between 25 to 60% by weight. His second patent reiterates these innovations, showcasing consistent creativity and focus on efficiency.

Career Highlights

Hiroyuki Onishi has collaborated with respected companies in his field, including Rengo Co., Ltd. and Kuraray Co., Ltd. These organizations are known for their specialization in the production of packaging materials, and Onishi's work has undoubtedly played a part in advancing their technologies.

Collaborations

Throughout his career, Onishi has had the pleasure of working alongside talented individuals such as Kinichi Shirakawa and Takatoshi Koyakumaru. Their collaboration has likely contributed to the innovative processes and patents that Onishi holds today.

Conclusion

Hiroyuki Onishi’s contributions to adhesive technology for corrugated board production exemplify his dedication to innovation. His patented processes stand as a testament to his skill and ingenuity in the field, promising advancements that benefit the packaging industry and beyond.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…