The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 25, 1989
Filed:
Oct. 30, 1985
Masateru Tokumo, Nishinomiya, JP;
Kinichi Shirakawa, Takatsuki, JP;
Takatoshi Koyakumaru, Kyoto, JP;
Takuji Okaya, Nagaokakyo, JP;
Hiroyuki Onishi, Kurashiki, JP;
Hiroji Kohno, Kawanishi, JP;
Kuraray Co., Ldt., both of, JP;
Rengo Co., Ltd., both of, JP;
Abstract
A process for production of corrugated board using an aqueous adhesive which contains polyvinyl alcohol and clay, or polyvinyl alcohol, clay and water-soluble boron compound, the ratio of clay to polyvinyl alcohol being in the range of 200 to 600 parts by weight based on 100 parts by weight of polyvinyl alcohol, the ratio of water-soluble boron compound being not more than 15 parts by weight based on 100 parts by weight of polyvinyl alcohol, the solid content of the adhesive being 25 to 60% by weight characterized in that