This inventor holds 1 USPTO granted patent. Top assignee: Hitachi Cable, Inc.. Active years: 2010.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2010
Title: Hiroyuki Ogawara and Nickel Plating Innovation
Introduction
Hiroyuki Ogawara is an inventor associated with Tsuchiura, Japan, and Hitachi Cable, Inc. His work includes a patent concerning nickel plating solutions and their preparation and use in producing printed wiring board copper foil.
Latest Patents
Ogawara is credited with 1 patent: “Nickel Plating Solution and Its Preparation Method, Nickel Plating Method and Printed Wiring Board Copper Foil.” The invention describes preparing an aqueous solution with 100 g/L or more and less than 200 g/L of nickel sulfate, together with specified concentrations of sodium citrate or citric acid. One preparation approach excludes nickel chloride, while another excludes boric acid. Both approaches adjust the solution’s pH to at least 2 and below 4. The patent also addresses nickel plating methods and copper foil for printed wiring boards.
Career Highlights
Ogawara’s listed patent reflects work on the composition and preparation of nickel plating solutions, with attention to ingredient concentrations and acidity. The supplied information associates him with Hitachi Cable, Inc.
Collaborations
Yasuhiro Kusano and Katsuyuki Matsumoto are identified as Ogawara’s coworkers.
Conclusion
Hiroyuki Ogawara’s patent focuses on defined nickel plating solution formulations and preparation methods relevant to printed wiring board copper foil.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile