This inventor holds 1 USPTO granted patent. Top assignee: Yamaha Robotics Co., Ltd.. Active years: 2025.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2025
Title: Hiroyuki Kasama: Innovator in Wire Bonding Technology
Introduction
Hiroyuki Kasama is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of wire bonding technology, which is crucial in the electronics industry. His innovative approach has led to the development of a unique wire bonding system that enhances the quality and efficiency of electronic component assembly.
Latest Patents
Hiroyuki Kasama holds 1 patent for his invention titled "Wire bonding system, inspection device, wire bonding method, and recording medium." This patent describes a wire bonding system that includes an acquisition unit for obtaining information about the diameter of a pressure-bonded ball. The system also features a storage unit for retaining this information and an inspection unit that evaluates the quality of wire bonding based on the stored data. This invention significantly improves the convenience of checking wire bonding quality.
Career Highlights
Hiroyuki Kasama is associated with Yamaha Robotics Co., Ltd., where he applies his expertise in robotics and automation. His work at Yamaha has allowed him to integrate advanced technologies into practical applications, furthering the capabilities of wire bonding systems in the industry.
Conclusion
Hiroyuki Kasama's contributions to wire bonding technology exemplify the innovative spirit of modern inventors. His patent not only enhances the quality assurance processes in electronics but also showcases the importance of continuous improvement in manufacturing techniques.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile